Company Profile

2024

  • Offered highly customized ASIC design services.
  • Received DEKRA ISO 26262 Automotive Functional Safety Engineer certification.
  • Released two dedicated memory test IPs: EZ-Safety and EZ-TEC.
  • Launched an eFlash-specific IP: eFlash BIST IP.

2023

  • Introduced a cost-effective memory diagnostic tool: EZ-Debug.
  • Launched a subscription-based cloud EDA tool service platform: iSTART Cloud.

2022

  • Executed a buyback of 500,000 shares of treasury stock.
  • Launched START v3 to target the automotive electronics market.
  • Established subsidiary “Shanghai iSTART-TEK Limited” in mainland China.
  • Secured Taiwan patent for ” METHOD FOR GENERATING AN MEMORY BUILT-IN SELF-TEST ALGORITHM CIRCUIT”.
  • Conducted a cash capital increase of NT$30,000 thousand, increasing paid-in capital to NT$254,170 thousand.

2021

  • Obtained approval as a Technology Based Enterprise.

2020

  • Cash capital increase of NT$17,000,000 and employee stock option certificate share exchange of NT$16,010,000 to increase the paid-in capital to NT$204,170,000.
  • Collaborated with the Nantong Institute of Nanjing University of Posts and Telecommunications to jointly cultivate talents.
  • Offered ISO 26262 functional safety requirements for automotive chips.
  • Launched START v2 to support the new generation of 5G technology.
  • Collaborated with Chung Hwa University to set up laboratories for talent cultivation.
  • Public offering of shares was approved.
  • Listing on the emerging stock market was approved.

2019

  • Renamed as “iSTART-TEK Incs.
  • Launched the lite-version memory test solution, EZ-BIST.
  • Offered memory testing algorithms for automotive chips.
  • Cash capital increase of NT$50,000,000 and employee stock option certificate share exchange of NT$10,580,000 to increase the paid-in capital to NT$171,160,000.

2018

  • Offered SRAM solution-START that combines inspection and repair.
  • Won the Golden Torch Award.
  • Employee stock option certificate share exchange of NT$2,520,000 to increase the paid-in capital to NT$110,580,000.

2017

  • Moved to Tai Yuen Hi-Tech Industrial Park.
  • Launched real-time non-volatile memory test and repair solutions.
  • Announced the new memory testing circuit development environment, BRAINS 3.0.
  • Cash capital increase of NT$55,000,000 to increase the paid-in capital to NT$108,060,000.

2016

  • Won the Golden Peak Award of Outstanding Enterprise and Outstanding Enterprise Initiators.
  • Announced the accumulative memory repairing technology H.E.A.R.T.
  • Cash capital increase of NT$13,560,000, debt to capital increase of NT$21,500,000, and capital reduction to cover loss of NT$10,116,000 to increase the paid-in capital to NT$53,060,000.

2015

  • Obtained Taiwan Patent: “Hybrid Self-Test Circuit Structure”.

2014

  • Obtained China Patent: “Hybrid Self-Test Circuit Structure”.
  • Obtained China Patent: “Algorithm Integrating System and Integrating Method Thereof”.
  • Obtained Taiwan Patent: “Algorithm Integrating System and Integrating Method Thereof”.
  • Obtained Taiwan Patent: “Embedded Testing Module”.
  • Obtained the U. S. Patent: “Algorithm Integrating System and Integrating Method Thereof”.

2013

  • Obtained the U. S. and Taiwan Patent: “Method for Repairing Memory and System Thereof” via technology transfer authorization from National Tsing Hua University.
  • Obtained the U. S. and Taiwan Patent: “Built-In Self-Repair Method for NAND Flash Memory and System Thereof” via technology transfer authorization from National Tsing Hua University.
  • Cash capital increase of NT$8,086,000 and debt-to-capital increase of NT$230,000 to increase the paid-in capital to NT$28,116,000.

2012

  • Cash capital increase of NT$8,222,000 and debt-to-capital increase of NT$3,278,000 to increase the paid-in capital to NT$19,800,000.
  • Obtained the U. S. Patent: “Hybrid Self-Test Circuit Structure”.

2009

  • Company establishment was approved with paid-in capital of NT$8,300,000.

2009

  • 本公司核准設立,實收資本額為8,300仟元。